RF plasma generators
Transform Your Process Innovation
Choose from a broad range of RF plasma generators and access unique features for configuration, control, and application requirements.
From various mounts and sizes to full digital control and plasma dynamic response, our RF generators can ignite your process innovation.
apex
High-Power Density for Compact Installation
The versatile Apex® family of RF generators and power delivery systems showcases a compact, modular design suitable for chamber mounting. Utilizing sophisticated RF conversion technology,
Apex RF generators and power delivery systems offer enhanced product and process reliability. High-density power capabilities make them ideal for advanced plasma processes.
And various communications models and configurable features allow you to customize your platform and explore integration approaches. No custom generator lead times are necessary.
DESCRIPTION
When space is limited, but performance is critical, streamlined Apex RF generators offer various mounting options and power you can rely on.
Chamber, rack, or frame-mount options for convenience and reduced power losses
Superb performance enhanced with arc management
1.5 to 10 kW output power options at 13.56 MHz frequency
APPLICATIONS
Flat panel displays
Semiconductor Manufacturing
Cesar
Unparalleled Breadth of RF-Application Delivery without Custom Lead Times
The proven Cesar® platform delivers consistent RF power, withstanding the harshest conditions in plasma processes.
The platform expertly handles high-load mismatches and remains fully functional at rated-reflected power. Cesar RF generators boast highly intuitive operating menus - accessible on large, front panel LCDs - that increase efficiency and minimize training costs.
Available in a diverse selection of models (2, 4, 13.56, 27.12, and 40.68 MHz; 0.3 to 5 kW) and equipped with high-quality components, Cesar RF generators maximize reliability and productivity.
DESCRIPTION
Robust and versatile, the Cesar platform provides excellent RF power delivery across a wide range of frequencies and power outputs.
Customized performance without custom lead times
Reliable design for maximum uptime
Powerful user interface for easy operation
FEATURES
Compact, streamlined design and standard platform packaging for easy replacement
High efficiency - less heat generated
RS-232, Ethernet, and Profibus communication
Active front panel with convenient, comprehensive operating menu
CEX (phase synch) operation mode
APPLICATIONS
Etch
Deposition
Semiconductor Manufacturing
eVoS LE
Asymmetric Bias Waveform Generator for Direct Control of Substrate Voltage and Ion Energy
The eVoS ™ LE is an asymmetric bias waveform generator designed to achieve direct control of wafer-surface voltage and resulting ion energy distributions (IED) in plasma-based etch and deposition processes.
The eVoS system is comprised of a bi-directional voltage supply combined with an independent current source to establish and control wafer-surface potential.
The asymmetric output of the eVoS eliminates the limitations and restrictions of wafer biasing inherent to sinusoidal RF bias application. Fast digital metrology and novel control algorithms enable the production of near mono-energetic IEDs.
Use additional parameters for customizing average and time-varying aspects of the wafer surface voltage and resulting ion energy distribution.
DESCRIPTION
The integrated, single-enclosure system delivers a customized width and precise control of ion energy for node etch and deposition applications. With a 1.2 kV asymmetric waveform, the eVoS LE applies metrology and proprietary control to deliver bias plasma performance for sensitive feature formation and efficiency unachievable by conventional RF methods.
Independently regulated voltage and current output for maximum control of bias conditions
Proprietary control system for direct manipulation of wafer bias characteristics
Fast, digitized metrology for real-time output monitoring and control
Improved efficiency with power applied directly to ion acceleration for less waste to heating
Enhanced ability to customize ion energy distribution, eliminate tails, and narrow distributions to maximize concentration to process-optimal levels
BENEFITS
Achieve direct control of wafer bias voltage and resulting ion energies
Gain enhanced ion energy selection / discrimination when compared to a RF bias method
Significantly increase etch selectivity for shorter processes and straighter, deeper features
Use less power by using the "right power," only delivering the useful ion energy
Simplify bias power integration
FEATURES
Ability to produce near mono-energetic ion energy distributions
Pulse capability with necessary input and output signals for synchronization
Integrated design and compact size eliminates need for matching network
High-speed metrology provides real-time bias voltage and ion current feedback
Narrow, broad, and multi-peak distributions
Adaptable to standard chamber interface
APPLICATIONS
Semiconductor Manufacturing
Etch
Deposition
HiLight
A Compact, Economical, Easy to Install, Low Power RF Platform
Designed for use with 230 VAC, single-phase input power, the HiLight ™ generators provide up to 600 W into a 50 Ω, non-reactive load.
HiLight RF generators provide accurate power regulation and incorporate internal protection limits that enable safe and reliable operation.
The RF generators are compact and lightweight, permitting you to mount directly on the tool or chamber. HiLight generators are controlled via a 25-pin analog user port.
DESCRIPTION
Compact, lightweight, and air-cooled, HiLight ™ RF generators are ideal for low-power, on-board applications, suiting 13.56 MHz plasma and 1 or 2 MHz processes.
Economical
Flexible, single-phase input
Compact design
BENEFITS
Easily install in non-19 "rack mounts
Increase accuracy and reliability with wave or pulsing modes
APPLICATIONS
Semiconductor Manufacturing
Etch
Deposition
LFGS
Economical, Mid-Frequency Generator Tailored for Plasma Processing
The versatile, variable-frequency LFGS generator (1250 W, 40 to 500 kHz) suits a wide variety of semiconductor and general plasma-processing applications, including sputtering, reactive ion etching, plasma deposition, polymerization, and surface treatment. Its compact 19 ", rack-mountable, air-cooled package eases installation and saves valuable space.
With a half-bridge, class-D amplifier design, the LFGS power supply enables the lowest reflected power commercially available.
DESCRIPTION
Wide-output frequency range
Compact design
Flexible communication protocol
BENEFITS
Support a wide variety of applications
Access the lowest reflected power commercially available
Easily install
Efficiently use valuable space
FEATURES
Variable frequency
Air cooling
Enhanced operating menu
Active front panel
Pulse mode (0 to 10 kHz) CEX operation mode 2 analog user ports
RS-232, Ethernet, and Profibus communication
APPLICATIONS
Deposition
Etch
Paramount
Industry-Leading, Repeatable Power Delivery for Core Plasma Applications
Advance your process development with a new focus on operating flexibility. Paramount® RF generators offer wide frequency and power ranges, support multiple integration scenarios, and are equipped with standard serial or analog interfaces.
The Paramount HP 10013 offers higher power enabling high plasma density and ion energy required by high aspect ratio devices and speeds process for the next node of semiconductor processing tools.
The Paramount platform's digital architecture provides precise power management and streamlines new function integration - no lead times or hardware changes needed. High-power output and repeatable performance is achieved by real-time detection of plasma changes.
And internal-protection limits facilitate reliable operation.
DESCRIPTION
Paramount RF power generators combine frequency tuning, pulsing, and complete digital control.
Full digital control for dynamic response to plasma changes
Customizable frequency from 400 kHz to 60 MHz and power from 1.5 to 10 kW
Advanced features for control optimization and synchronization
BENEFITS
Enhance plasma stability and process repeatability
Precisely control RF power
Quickly respond to plasma changes
Easily adapt to meet specific application needs
APPLICATIONS
Deposition
Etch
Semiconductor Manufacturing
Paramount HFi
Compact, Cost-Effective Integrated Generator and Solid-State Matching RF Power Delivery System
The Paramount® HFi is an integrated RF delivery solution for deposition and other semiconductor plasma-based processes. An electrically switchable solid-state capacitor array is physically integrated with the RF power amplifier providing the most compact form-factor power delivery system available.
With an overall package size nearly equal to that of a traditional RF power generator, this design also includes the matching network within the common enclosure. The matching network, with 32 tune range positions, allows for reliable RF power delivery across a wide range of impedances.
In addition to a reduced footprint, mechanically driven vacuum capacitors are replaced in the integrated matching network with solid state components for increased reliability and repeatability - crucial attributes in high-cycle, repetitive processes.
By eliminating the traditional stand-alone vacuum capacitor matching network, very fast tuning and direct power regulation are achieved, reducing latency in today's short-cycle, high step-count deposition processes.
DESCRIPTION
Advanced Energy's Paramount HFi is a 13.56 MHz RF power delivery system with an integrated solid-state matching network capable of operating across a wide variety of impedance zones. The solution offers consistent power delivery, high power density, and exceptional reliability.
Minimize footprint by mounting the integrated system directly onto the chamber
Achieve repeatable power delivery across a wide impedance zone with 32 tune range positions
High reliability and reproducibility due to no moving parts
BENEFITS
Utilize faster tuning speeds to enables stable performance even in the shortest process steps
Decrease costs with integrated package configuration when compared to separate generator and matching network
Free up valuable real estate on multi-wafer chamber deposition systems with reduced footprint
FEATURES
32 tune range positions with millisecond switching speeds to enable the shortest process steps
Controllable tune range positions optimize the impedance range to customer process
Water-cooled with no requirements for external air exchange
Common exciter (CEX) mode to sync multiple systems in cluster configurations
RS-232, Ethernet, and EtherCAT communication
APPLICATIONS
Semiconductor Manufacturing
Deposition
Paramount Plus
Multi-Level Pulsing and Pulse Waveform Control for Emerging Plasma Applications
Get the broadest feature set available in a pulsed RF product. The Paramount Plus offers precise RF regulation, sophisticated pulse manipulation, and advanced data acquisition.
Designed to cover an extensive range of RF energy - frequencies of 400 kHz to 60 MHz and power levels of 1.5 to 15 kW - the Paramount Plus delivers the repeatability and reliability you require.
DESCRIPTION
Paramount Plus offers progressive technology and customizable features that include premier pulsing control.
Precise RF and pulse control
Fast response to plasma changes
Built-in diagnostic tools
BENEFITS
Precisely control RF
Enhance plasma stability
Expedite plasma transitions
Reduce process times
Improve process repeatability and chamber matching
FEATURES
Enhanced RF stability with tightly regulated power output
Advanced multi-level pulsing
Pulse synchronization and monitoring
Real-time power and impedance measurement
Advanced FastDAQ data acquisition system
APPLICATIONS
Flat panel displays
Semiconductor Manufacturing
PDX
Proven, Mid-Frequency Workhorse with Industry-Leading Reliability
Need a highly efficient, compact, easy-to-integrate power source? The PDX® series provides extremely accurate, highly repeatable process control, helping to ensure process uniformity and high throughput.
It's wide frequency range of operation delivers optimal control across numerous applications.
The PDX low-power (LP) series is available in 1250 W and 1400 W versions and the PDX high-power (HP) series is available in 5000 W and 8000 W versions.
DESCRIPTION
The PDX series features mid frequency power supplies that enhance process flexibility and optimize control.
Available in power ranging from 1250 to 8000 W.
Wide frequency range operation
Remote operation capabilities
BENEFITS
Enhance process flexibility
Improve throughput
Optimize process control
Ensure high repeatability
Ease integration
APPLICATIONS
Deposition
Etch
Semiconductor Manufacturing